• Fast curing
• Green colour
• Bonds in damp conditions
• Bonds to most substrates
• Solvent free
• High strength

Ensure that the surfaces to be bonded are smooth, clean and free from dust or other deposits. 

Slight moistening of substrates improves the curing rate and gap filling properties. The 1-component adhesive H700 is best used between 5ºC-30º. Beware of too much water. We recommend a preliminary compatibility test before bonding of desired substrates.

Use the Henko glue box or a hand trowel to distibute an even amount of adhesive on to the desired area or seam tape.

Pressing the materials during curing is necessary to obtain the highest bond strength and should be done within the 20-30 minute open time. Presuure upon joints is always advised to obtain the highest bond strength.

Cured adhesive has to be removed mechanically.

Henko H700 should be stored in a cool, dry place, at a temperature range of between 5°C and 25°C. In these conditions it has a storage life of at least 9 months.

Not recommended for use with plasticised vinyl’s, flexible plastics, expanded/extruded polystyrene, PE or PP.

Always test H700 to determine suitability for your particular application prior to use in production.

The following products are recommended for use with the Henko H700 adhesive:

• Henko glue box
• Henko hand trowel
• 200mm seam tape