• Fast curing
• Green colour
• Bonds in damp conditions
• Bonds to most substrates
• Solvent free
• High strength

Ensure that the surfaces to be bonded are smooth, clean and free from dust or other deposits. Most construction grade materials are suitable such as wood, concrete, brick, insulation materials, porous and non-porous.

Slight moistening of substrates improves the curing rate and gap filling properties. We recommend a preliminary compatibility test before bonding of desired substrates.

The adhesive should be applied within the temperature range of +5˚C to +25˚C. Cut the tip of the cartridge ensuring the thread is left intact. Screw nozzle on to the cartridge and cut an aperture relevant to the application requirement. Load the cartridge into a sealant gun and apply the adhesive in beads. Join the parts together within 10 minutes. Pressing the materials during curing is necessary to obtain the highest bond strength.

Cured adhesive has to be removed mechanically.

Henko H400 should be stored in a cool, dry place, at a temperature range of between 5°C and 25°C. In these conditions it has a storage life of at least 9 months.

Not recommended for use with plasticised vinyl’s, flexible plastics, expanded/extruded polystyrene, PE or PP.

Always test H700 to determine suitability for your particular application prior to use in production.

The following products are recommended for use with the Henko H400 adhesive:

• Cox hand applicator
• Cox electric applicator
• 200mm seam tape